Housing with integrated circuit, light micrograph. The image shows an opened transistor outline (TO) metal housing with the mounted semiconductor chip. TO packages consist of a TO base and a TO cap. The TO socket forms the base for mounting the encapsulated semiconductor component and supplies it with power. The semiconductor in this image is a 741 operational amplifier, manufactured in 1980. Golden bond wires connect the pins of the TO base with the semiconductor chip. Microscopic contrast method: incident darkfield. Magnification: x80 when printed at 10 centimetres wide. | |
Lizenzart: | Lizenzpflichtig |
Credit: | Science Photo Library / Guenther, Gerd |
Bildgröße: | 5616 px × 3742 px |
Modell-Rechte: | nicht erforderlich |
Eigentums-Rechte: | nicht erforderlich |
Restrictions: | - |